litaba

1. Tlhoko ea Bohlokoa ho tsoa ho Li-server tsa AI le Litsi tsa Lintlha

Li-server tsa AI li emela mohloli o moholo ka ho fetisisa oa tlhoko e ntseng e eketseha bakeng salesela la khalase la faeba le se nang dielectric e tlase. Mekhoa ea koetliso ea AI le ho etsa qeto e itšetlehile ka phapanyetsano e kholo ea data, e leng se hlokang tšebeliso ea li-PCB tse nang le palo e phahameng le mahlale a khokahano a lebelo le phahameng; sena se beha litlhoko tse feteletseng thepa ea dielectric le botsitso ba litekanyo tsa thepa. Ka ho amoheloa ha mahlale a kang li-module tsa PCIe 6.0 le 224G optical, litlhoko tsa ts'ebetso bakeng sa li-laminate tse koahetsoeng ka koporo (CCL) ho li-server tsa AI li fetohile ho tloha ho tahlehelo e tloaelehileng e tlase ho ea ho li-grade tsa tahlehelo e tlase (ULL) le tahlehelo e phahameng (HLL), e leng se khannang ka kotloloho keketseho ea tlhoko ea li-grade tse tsamaellanang tsa lesela la faeba ea khalase ea dielectric e tlase. Lintlha tsa 'maraka li bontša hore boleng ba li-CCL ho li-server tsa AI bo makhetlo a 5 ho isa ho a 8 ho feta li-server tsa setso. Jwalo ka thepa ea mantlha e tala, lesela la faeba ea khalase ea dielectric e tlase le bone theko ea lona e fihla ho 320,000–350,000 RMB/ton ka 2025—keketseho ea 20% ho tloha qalong ea selemo—ka mehlala e meng e itseng e bileng le keketseho ea litheko e fihlang ho 250%–300%.

Mabapi le sekheo sa tlhokeho ya phepelo, se susumetswang ke tlhokeho e ntseng e eketseha ho tloha ho bareki ba AI ba tlase le dithibelo bokgoning ba tlhahiso ya masela a elektroniki a maemo a hodimo, maemo a polokeho a masela a elektroniki a maemo a hodimo ho bahlahisi ba ka sehloohong ba CCL a theohile ho ya ho phepelo e ka tlase ho beke e le nngwe, e leng se bontshang boemo bo tlase nalaneng. Ho fihlela tlhokeho ya dihlahiswa tsa maemo a hodimo, bahlahisi ba CCL ba qobellehile ho phahamisa ditheko tsa theko. Ka lebaka la mekgwa ya hajwale ya ditheko le sebaka sa tlhokeho ya phepelo, masela a faeba ya khalase a maemo a hodimo a itokiseditse ho bona keketseho e ts'oanang ya bophahamo le theko.

2. Litlhoko tsa Ts'ebetso bakeng sa Sephutheloana sa Chip se Phahameng

Theknoloji e tsoetseng pele ea ho paka bakeng sa li-chip tsa AI e emela boemo bo bong ba bohlokoa ba ts'ebeliso bakeng salesela la khalase la faeba le se nang dielectric e tlase. Ha lits'ebetso tsa tlhahiso ea li-chip li ntse li tsoela pele ho ea ho node ea 3nm le ho feta, bongata ba liphutheloana bo ntse bo eketseha. Li-substrate tsa ABF—lijari tsa bohlokoa tse hokahanyang li-chip ho li-PCB—li beha litlhoko tse thata haholo holim'a thepa ea dielectric le bohloeki ba thepa ea tsona ea motheo. Ka tloaelo, kamehla ea dielectric e tlameha ho oela ka har'a mefuta ea 3.0–4.0 (ho 1 MHz), ho latela maqhubu a ts'ebetso, ha ntlha ea ho qhala (Df) e tlameha ho laoloa pakeng tsa 0.005 le 0.010 (ho 1 MHz); lits'ebetso tsa maqhubu a phahameng (joalo ka 5G le puisano ea lebelo le phahameng) li ka hloka boleng bo tlase le ho feta (<0.005). Ho feta moo, ho fihlela litlhoko tsa liphutheloana tse phahameng, thepa e tlameha ho leka-lekanya Coefficient of Thermal Expansion (CTE) e tlase le khanyetso e phahameng ea mocheso ho thibela ho robeha ha potoloho ho bakoang ke khatello ea mocheso. Lesela la faeba la Quartz (le tsejoang hape e le "lesela la Q" kapa "lesela la elektroniki la moloko oa boraro") le hlahile e le thepa e ratoang bakeng sa li-substrate tsa ABF ka lebaka la botsitso ba lona bo tlase ba dielectric (2.2–2.3), tahlehelo e nyane ea dielectric (Df ea 0.001–0.0005), le bokhoni ba ho mamella mocheso oa ts'ebetso oa nako e telele oa 600°C kapa ho feta.

Keketseho e potlakileng ea ho romelloa ha li-chip tsa AI lefatšeng ka bophara e khanna ka kotloloho keketseho ea tlhoko ea lesela la quartz. Ho ea ka likhakanyo tsa Future Think Tank, 'maraka oa lefats'e oa lesela la quartz o lebelletsoe ho fihla ho $3.127 bilione ka 2031, ka sekhahla sa kholo ea selemo le selemo (CAGR) sa 23.30%. Ponelopele ena e totobatsa mokhoa o nyolohang oa tlhoko, o itšetlehileng ka keketseho e tsoelang pele ea ho romelloa ha li-chip tsa AI le ho amoheloa ho pharalletseng ha mahlale a tsoetseng pele a ho paka. Ho feta moo, nts'etsopele ea li-platform tsa AI tsa moloko o latelang - joalo ka "Rubin" - e tsamaellana le lits'ebetso tsa tlhahiso ea li-chip tsa 3nm kapa N4 'me e sebelisa liphutheloana tsa substrate tse kholo haholo tsa CoWoS-L. Li-platform tsena li kopanya li-stack tse robeli tsa HBM4 ho fihlela litlhoko tsa bandwidth e phahameng le khokahano, li fana ka tharollo e nepahetseng bakeng sa ho eketsa matla a khomphutha. Litlhoko tsa li-substrate tse kholo haholo le ts'ebetso e feteletseng li tla holisa tlhoko ea lisebelisoa tse tala tsa lesela la quartz, li khanna phetoho ea masela a khalase a Low-Dk (a sa fetoheng a dielectric a tlase) ho ea ho li-constant tsa dielectric tse tlase le litšobotsi tse tlase tsa tahlehelo.

3. Litlamorao tsa Kgolo e Kopanetsweng ho pholletsa le Makala a Mangata

Ka nqane ho lekala la mantlha la matla a khomphutha a AI, tlhoko e tswang masimong a kang puisano ya 5G/6G le di-elektroniki tsa bareki ba maemo a hodimo e kganna kgolo ya tshebedisano mmoho le AI. Phetoho ho tloha ho 5G millimeter-wave (24–100 GHz) ho ya ho 6G terahertz technology (boemo ba maqhubu bo ka bang 100 GHz–3 THz) e kenyeletsa maqhubu a phahameng a etsang hore disebediswa tsa puisano di be bonolo haholo ho lahlehelwa ke matshwao. Le hoja mehla ya 5G e ne e hloka lesela la fiberglass le lahlehelwang haholo, mehla ya 6G e beha ditlhoko tse thata le ho feta bakeng sa dielectric constant (Dk) le dissipation factor (Df): Dk e tlameha ho theohela ho 2.0–3.0 (ho >100 GHz), mme Df e tlameha ho theoha ho tloha ho maemo a 5G a 0.003–0.005 (ho 10 GHz) ho ya ho 0.0001–0.0007 (ho 100 GHz), e leng se bakang tlhoko ya lesela la quartz le "lahlehileng haholo". Lefapheng la lisebelisoa tsa elektroniki tsa bareki, iPhone 17 e amohetse lesela le tlaase la CTE (coefficient of thermal expansion) le lesela le tlase la dielectric le fanoang ke Honghe Technology ho sebetsana le liphephetso tse kang ho kopanya chip ea A10 Pro 3nm, ho thibela ho sotha ka har'a li-motherboard tse nang le density e phahameng, le ho fokotsa tahlehelo ea matla matšoao a maqhubu a phahameng a 5G/Wi-Fi 7. Ketso ena e bontša phetoho e potlakileng ea masela a elektroniki a maemo a holimo ho tloha lits'ebetsong tsa indasteri ho ea ho lisebelisoa tsa elektroniki tsa bareki tse tloaelehileng, e leng se etsang hore tlhoko ea thepa e eketsehe le ho eketsa linako tsa ho tlisa. Ntlafatso e bohlale ea lisebelisoa tsa elektroniki tsa likoloi le eona e tlatsetsa tlhokong e eketsehileng; ho khanna ka boikemelo ho tsoetseng pele (Boemo ba 3 le ho feta) ho hloka li-sensor tse ngata tsa ADAS le li-radar tse nang le maqhubu a phahameng. Litsamaiso tsena li hloka botsitso ba phetisetso ea lets'oao, ts'epo ea nako e telele ea manonyeletso a solder, le ho mamella maemo a likoloi khahlanong le ho thothomela, mocheso le mongobo. Ka lebaka leo, lisebelisoa tsa boto ea potoloho tse nang le li-constant tse tlase tsa dielectric, tahlehelo e tlase ea dielectric, khanyetso ea CAF (conductive anodic filament), le CTE e tlase e fetohile khetho e ratoang bakeng sa litsamaiso tse tsoetseng pele tsa ho khanna tse bohlale, e leng se potlakisang ho amoheloa ha lesela la fiberglass le nang le maemo a holimo. Liponelopele tsa indasteri li bontša hore 'maraka oa lefats'e oa lesela la elektroniki le sa fetoheng ka motlakase o tlase o ka fihla ho li-yuan tse libilione tse 3.76 ka 2031, o hola ka sekhahla sa selemo le selemo sa 10.1% - mokhoa o susumetsoang haholo-holo ke ho kopana ha tlhoko makaleng a mangata.

Moeli o ka sehloohong oa ho holisa matla a khomphutha o holim'a ho phunyeletsa meeli ea 'mele ea thepa. Ho tloha ho li-PCB tse lahleheloang haholo tse sebelisoang li-server tsa AI le lesela la quartz ka har'a liphutheloana tse tsoetseng pele ho ea ho li-laminate tsa maemo a holimo bakeng sa lisebelisoa tsa elektroniki tsa bareki le ho khanna ka boikemelo, lesela la fiberglass la dielectric e tlase le kena "motsotsong o e-so ka o bonoa." Har'a naha ea tlhoko ea phepelo e khetholloang ke bophahamo bo ntseng bo eketseha, litheko tse ntseng li eketseha, le khaello ea bokhoni, "lesela lena la elektroniki" le bonahalang le le bobebe ntle le pelaelo le hlahile e le le leng la makala a kholo e phatlohang ka ho fetisisa a hokahanyang meralo ea motheo ea lisebelisoa tsa AI le mahlale a puisano a maqhubu a phahameng a moloko o latelang.