Bulk Phenolic Fiberglass Molding Compound
Kenyelletso ea Sehlahisoa
Bulk phenolic glass fiber molding compound ke thermosetting molding compound e entsoeng ka phenolic resin e le thepa ea motheo, e matlafalitsoeng ka likhoele tsa khalase, 'me e entsoe ka ho kenngoa, ho kopanya le mekhoa e meng. Sebopeho sa eona hangata se kenyelletsa phenolic resin (binder), fiber ea khalase (lisebelisoa tse matlafatsang), filler ea diminerale le li-additives tse ling (tse kang lelakabe la mollo, moemeli oa ho lokolla hlobo, joalo-joalo).
Litšobotsi tsa Ts'ebetso
(1) Lintho tse ntle tsa mochini
Matla a holimo a ho kobeha: lihlahisoa tse ling li ka fihla 790 MPa (ho feta tekanyo ea naha ≥ 450 MPa).
Khanyetso ea tšusumetso: matla a ts'ebetso a notched ≥ 45 kJ/m², a loketse likarolo tse tlas'a meroalo e matla.
Ho hanyetsa mocheso: Mocheso oa Martin o sa keneleng mocheso ≥ 280 ℃, botsitso bo botle ba boemo bo phahameng mochesong o phahameng, o loketseng lits'ebetso tse phahameng tsa mocheso oa tikoloho.
(2) Thepa ea ho kenya motlakase
Bokaholimo ba ho hanyetsa: ≥1×10¹² Ω, ho hanyetsa molumo ≥1×10¹⁰ Ω-m, ho finyella litlhoko tse phahameng tsa ho kenya letsoho.
Arc resistance: lihlahisoa tse ling li na le nako ea ho hanyetsa arc ≥180 metsotsoana, e loketseng likarolo tse phahameng tsa motlakase.
(3) Ho hanyetsa kutu le ho lieha ha lelakabe
Corrosion resistance: e hanyetsana le mongobo le hlobo, e loketse libaka tse chesang le tse mongobo kapa tse senyang lik'hemik'hale.
Kereiti e thibelang malakabe: lihlahisoa tse ling li fihlile ho UL94 V0 grade, tse sa cheng haeba ho e-na le mollo, mosi o tlaase le o se nang chefo.
(4) Ho ikamahanya le maemo
Mokhoa oa ho bopa: ho tšehetsa ho bōptjoa ha ente, ho fetisetsoa ho bōptjoa, ho bōptjoa ha compression le mekhoa e meng, e loketseng likarolo tse rarahaneng tsa meralo.
Ho fokotseha ho tlaase: ho fokotseha ha ho bōpa ≤ 0.15%, ho nepahala ha ho bopa ho phahameng, ho fokotsa tlhokahalo ea ho sebetsa ka morao.
Tekheniki Parameters
Tse latelang ke tse ling tsa likarolo tsa tekheniki tsa lihlahisoa tse tloaelehileng:
| Ntho | Sesupo |
| Boima ba 'mele (g/cm³) | 1.60 ~ 1.85 |
| Matla a ho kokota (MPa) | ≥130~790 |
| Tšireletso ea Lefatše (Ω) | ≥1×10¹² |
| Dielectric loss factor (1MHz) | ≤0.03~0.04 |
| Ho monya metsi (mg) | ≤20 |
Lisebelisoa
- Indasteri ea elektromechanical: Ho etsa likarolo tse sireletsang matla a phahameng joalo ka likhetla tsa makoloi, li-contactor, li-commutators, jj.
- Indasteri ea likoloi: e sebelisoa likarolong tsa enjene, likarolo tsa sebopeho sa 'mele, ho ntlafatsa ho hanyetsa mocheso le boima bo bobebe.
- Aerospace: likarolo tsa sebopeho se hanyetsanang le mocheso o phahameng, joalo ka likarolo tsa rokete.
- Lisebelisoa tsa elektronike le tsa motlakase: likarolo tse phahameng tsa motlakase, ho fetola ntlo, ho finyella litlhoko tsa ho thibela lelakabe le ts'ebetso ea motlakase.
Tlhokomeliso ea Ts'ebetso le ho Boloka
Ho hatella tshebetso: mocheso 150 ± 5 ℃, khatello ea 18-20Mpa, nako 1 ~ 1.5 min / mm.
Boemo ba polokelo: Sireletsa ho tloha khanyeng le mongobo, nako ea polokelo ≤ likhoeli tsa 3, chesa ka 90 ℃ bakeng sa 2 ~ 4 metsotso ka mor'a mongobo.
